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Technologies needed for semiconductor development?
China Semiconductor needs to break through three core technologies: including FPGA, design software and semiconductor equipment, which are the three basic semiconductor equipment that need to be broken through.

FPGA is called a general chip, which can be quickly programmed into a special chip. This is a powerful weapon for small batch of special chips, and it is also an essential link in chip design of many companies.

The second is to design software. The first echelon consists of internationally renowned EDA enterprises such as Synopsys, Cadence and SiemensEDA.

The third is chip manufacturing equipment. Practically speaking, chip manufacturing equipment is better than the first two. At present, to solve the problem of full localization of 28nm is basically worse than that of mask aligner. In addition to these problems, there are breakthroughs in materials, adhesives, chemicals and gases. In fact, the gap and chain breakage in China's industrial chain are quite serious. This is an area where domestic comparative advantage was relatively poor in the past. If it breaks through, the subsequent industrial system will be much better.

The underlying semiconductor technology is divided into four categories: 1, and the chip equipment: nano-scale cookware (ASML, AMAT, Beifang Huachuang, Tuojing).

2. Chip material: atomic ingredients (SUMCO, Xinyue, Hu Si, Zhonghuan).

3. Processing and manufacturing: Michelin chefs (TSMC, SMIC, Hua Hong, Changcun).

Menu of 4.IP/EDA: Chip Architects (ARM, Xinsi, SGD, Huada)

As the most upstream and high-end industry of chip design, EDA is also the weakest link in the domestic chip industry chain. The industrial ecological foundation of EDA software development is the support of foundry and the cultivation of chip design company.