2. Detail layer: the details of ceiling nodes, including the dimensions and assembly relations of suspenders, keels, connectors and other components, the treatment of material joints (such as gypsum board joints and corner treatment), the specific installation methods of lamps, tuyeres and other equipment in the ceiling, and the details of special design parts such as decorative lines and grids.
3. Profile layer: internal structure layer, various material layers (such as insulation layer, sound insulation cotton, fireproof material, decorative board, etc.). ) and the contour representation of the ceiling height change after the ceiling system is cut.
4. Electrical circuit layer: lighting circuit direction, lamp connection and weak current circuit layout (such as security, sound, network, etc. ).
5. Notes and text layer: size, text description, index symbol, material name and specification, etc.
6. Reference layer: including walls, floors or other related building elements as background reference.