What does Huatian Technology do?
Huatian Technology is Tianshui Huatian Technology Co., Ltd., which was established on February 25th, 2003 and listed on Shenzhen Stock Exchange on October 20th, 2007. The company is mainly engaged in semiconductor integrated circuit packaging and testing business. At present, the company's integrated circuit packaging products mainly include DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, BGA/LGA, FC, MCM(MCP), SiP, WLP, TSV, Bumping, MEMS and other series, and the products are mainly used in computers. The annual packaging scale and sales revenue of the company's integrated circuits rank second among listed companies in the same industry in China.
In recent years, the company has continuously strengthened the research and development of advanced packaging technology and products, increased R&D investment, improved the construction of R&D simulation platform with Huatian Xi 'an as the main body, and relied on R&D verification platforms such as National Enterprise Technology Center, Gansu Microelectronics Engineering Technology Research Center and Gansu Microelectronics Engineering Laboratory, through the implementation of national science and technology major project 02 and other scientific and technological innovation projects, as well as the continuous research and development of new products, new technologies and new processes. We have independently developed many advanced integrated circuit packaging technologies and products such as FC, Bumping, MEMS, MCM(MCP), WLP, SiP, TSV and Fan-out. With the company's further technological innovation, the company's technological competitive advantage will continue to improve.
This is the end of the introduction of Huatian Technology. I hope the content is helpful to you.